Digi International (Minnstonka, Minn., U.S.A.) on Tuesday announced that its embedded 3G system-on-module has been certified by Sprint (Overland Park, Kan., U.S.A.), which allows M2M device manufacturers to add 3G connectivity to their devices without having to go through a certification process.
ConnectCore 3G -- the embedded 3G system-on-module with integrated application processing- also offers cloud connectivity with the iDigi Device Cloud.
By using the cloud, device manufacturers can remotely configure, upgrade, monitor and troubleshoot devices, as well as create applications, says Digi. The Cloud also lets customers using the ConnectCore 3G configure and manage device deployments and integrate with customer applications.
The ConnectCore 3G features Qualcomm Gobi technology and supports High Speed Packet Access (HSPA) or Evolution-Data Optimized (EV-DO) networks from the same cellular radio. According to Digi, this allows customers to develop one solution for use anywhere in the world with the same hardware.
The module is programmable in iDigi's application framework and Python. ConnectCore 3G Digi JumpStart Kits are available for $499.