(Reuters) - International Business Machines Corp said on Tuesday it will invest $3 billion over the next four years in a new 'Internet of Things' unit, aiming to sell its expertise in gathering and making sense of the surge in real-time data.
The Armonk, New York-based technology company said its services will be based remotely in the cloud, and offer companies ways to make use of the new and multiplying sources of data such as building sensors, smartphones and home appliances to enhance their own products.
FRANKFURT (Reuters) - Intel has agreed to buy German network chipmaker Lantiq for an undisclosed amount to expand its range of chips used in Internet-connected gadgets, the companies said on Monday.
The former Infineon unit was bought in 2009 by private equity firm Golden Gate Capital for 250 million euros ($280 million). Deutsche Telekom was among the companies invested in Lantiq through Golden Gate.
The global market for M2M modules is set to double in value between now and 2018, to around $2.9 billion, according to new data from Infonetics Research.
“The services built upon mobile M2M modules, such as fleet management and connected car, are already a sizeable business and are growing much faster than traditional business lines,” said Godfrey Chua, the directing analyst for M2M and the Internet of Things at Infonetics.
The UK’s Plastic Logic has formed a partnership with US-headquartered Solvay Specialty Polymers aimed at developing low-power flexible electronics for sensors, mobile displays and wearable devices.
The two companies say they have committed to a joint development program that will demonstrate and industrialize low-power variants of such devices within two years.
Plastic Logic (Cambridge, UK) is regarded as a leader in the development of organic thin-film transistors, while Solvay (Alpharetta, GA, USA) produces high-performance polymers.
Hardware players Advantech and Linear Technology have joined forces with the aim of developing new smart-city and Internet of Things (IoT) technology based on embedded wireless sensor networks.
In a statement, Advantech (Taipei, Taiwan) said it would develop, make and sell a variety of IoT gateways, wireless sensors and solutions incorporating the SmartMesh IP technology developed by Linear Technology’s (Milpitas, CA, USA) Dust Networks product group.
Telit has launched a new automotive business unit following its takeover of a platform business from Dutch company NXP Semiconductors.
The UK-headquartered hardware player says it has now completed the acquisition of NXP’s (Eindhoven, Netherlands) automotive telematics on-board unit platform (ATOP) business, which develops technology allowing vehicle makers to implement eCall or similar functionality in a straightforward and cost-efficient way.
M2M hardware players Telit and NimbeLink say they have formed a partnership to speed up the design of specialized systems for M2M applications.
Under the Skywire brand, NimbeLink (Plymouth, MN, USA) has launched a series of embedded modems that use Telit’s (London, UK) xE910 family of modules, allowing designers to incorporate cellular connectivity into their products.
The first Skywire module comes with an embedded 2G CDMA 1xRTT product that is described by the companies as the smallest embedded cellular modem on the market.
M2M Zone exhibitors gathered at this week’s CeBIT tradeshow in Hannover, Germany unveiled details of some exciting new products and services, while others provided updates on their strategies for addressing the ever-expanding M2M opportunity. Below we provide summaries of the main announcements.
Intrinsyc Software says it has received an $850,000 order from a “leading asset tracking company” for M2M modules designed by AnyDATA, whose products Intrinsyc distributes.
Indicating that delivery is scheduled for the second half of the year, Intrinsyc (Vancouver, Canada) said the company was looking to use the ultra-small, low-power module in a range of asset-tracking and monitoring applications.
Middleware supplier HCC Embedded has launched a new smart-meter file system (SMFS) designed to reduce power consumption and lower costs.
The company says its technology cuts down on expenses because it allows the on-board capacitor to be as small as possible, and that its file-system features can result in savings of many “cents” for each meter.
That could lead to significant savings in high volume manufacture, says HCC Embedded.
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