DesignCon 2014

Date
Start Date: 
Tuesday, January 28, 2014
End Date: 
Friday, January 31, 2014

California:

 DesignCon is the premier technical conference and exhibition for chip, board and systems design engineers involved in signal integrity in the high-speed communications and semiconductor communities. 

Taking place over four days in Silicon Valley, DesignCon is the largest educational conference and technology exhibition for chip, board and systems design engineers in the high-speed communications and semiconductor communities. 

With over 120 technical paper sessions, 3 keynotes, tutorials, industry panels, and emerging products 150+ top tier vendors, DesignCon brings engineers the latest theories, methodologies, applications and advanced design tools on signal and power integrity, jitter and crosstalk, test and measurement, parallel and memory interface design, ICs, semiconductor components and more – so they can discover new insights, solutions and tools, and drive their current and next-gen designs to success. 

http://atnd.it/18MT7EI

ArticleTools

Featured Reports

Global Connected Consumer Devices: Key Trends, Opportunities and Market Forecasts 2015 - 2020

An evaluation of Connected Consumer Device ecosystems, market drivers, constraints, and opportunities for value chain constituents
Learn More

 

End-to-End M2M, Seventh Edition
This report includes forecast data for the period 2014 – 2019 with analysis of key drivers, success factors, and industry dynamics.
Learn More

 

The Future of Cloud WAN
The emergence of cloud computing has put new demands on the WAN. Not only do customers demand highly robust and secure WAN connections, but they must also deliver new levels of flexibility and manageability.
Learn More